Publication detail

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

VALA, M.

Original Title

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

English Title

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Type

conference paper

Language

Czech

Original Abstract

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.

English abstract

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages, eg.: modern x-ray defect detection.

Keywords

X-ray, Defect, Analysis, X-plane, Void

Key words in English

X-ray, Defect, Analysis, X-plane, Void

Authors

VALA, M.

Released

30. 4. 2016

ISBN

978-80-214-5350-0

Book

Proceedings of the 22nd Conference STUDENT EEICT 2016

Pages from

206

Pages to

208

Pages count

789

URL

http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf

BibTex

@inproceedings{BUT130790,
  author="Martin {Vala}",
  title="ANALYSIS OF DEFECTS ON PCB USING X-RAY, 
3D SW CERA AND MICRO-SECTIONS",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="206--208",
  isbn="978-80-214-5350-0",
  url="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf"
}