Detail publikace

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

Originální název

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

Anglický název

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

Jazyk

en

Originální abstrakt

This article deals with defects of the solder joints and their identification. These defects arise in the form of cracks during the thermoelectric cycling. A system capable of identifying these failures and theirs digital process is described below. Moreover, the article defines how to identify errors, the principle of function of the entire system and its parameters. At the end of this article the benefits of this kind of system in practice are described.

Anglický abstrakt

This article deals with defects of the solder joints and their identification. These defects arise in the form of cracks during the thermoelectric cycling. A system capable of identifying these failures and theirs digital process is described below. Moreover, the article defines how to identify errors, the principle of function of the entire system and its parameters. At the end of this article the benefits of this kind of system in practice are described.

BibTex


@inproceedings{BUT107857,
  author="Tomáš {Vejmola} and Josef {Šandera}",
  title="SOLDER JOINT FAILURE IDENTIFICATION SYSTEM",
  annote="This article deals with defects of the solder joints and their identification. These defects 
arise in the form of cracks during the thermoelectric cycling. A system capable of identifying these 
failures and theirs digital process is described below. Moreover, the article defines how to identify 
errors, the principle of function of the entire system and its parameters. At the end of this article the 
benefits of this kind of system in practice are described.",
  booktitle="In Proceedings of the 20th conference Student EEICT 2014",
  chapter="107857",
  howpublished="online",
  year="2014",
  month="april",
  pages="205--208",
  type="conference paper"
}