Publication detail

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

VEJMOLA, T. ŠANDERA, J.

Original Title

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

Type

conference paper

Language

English

Original Abstract

This article deals with defects of the solder joints and their identification. These defects arise in the form of cracks during the thermoelectric cycling. A system capable of identifying these failures and theirs digital process is described below. Moreover, the article defines how to identify errors, the principle of function of the entire system and its parameters. At the end of this article the benefits of this kind of system in practice are described.

Keywords

PC, identification, system, solder, PCB, cycle

Authors

VEJMOLA, T.; ŠANDERA, J.

RIV year

2014

Released

24. 4. 2014

ISBN

978-80-214-4922-0

Book

In Proceedings of the 20th conference Student EEICT 2014

Pages from

205

Pages to

208

Pages count

302

BibTex

@inproceedings{BUT107857,
  author="Tomáš {Vejmola} and Josef {Šandera}",
  title="SOLDER JOINT FAILURE IDENTIFICATION SYSTEM",
  booktitle="In Proceedings of the 20th conference Student EEICT 2014",
  year="2014",
  pages="205--208",
  isbn="978-80-214-4922-0"
}