Course detail

Microelectronic technologies

FEKT-DME2Acad. year: 2020/2021

The course is focused on the study of microtechnologies in the form of seminars and self-study. Students will gain an overview of basic and advanced methods and techniques, the use of materials and the rules of microstructure creation. They will be able to orientate in the area of the design and fabrication of thin films and MEMS including the use of micro- and nanotechnologies in microelectronics.

Learning outcomes of the course unit

Preview of the mehods and techniques in thin-film and semicoductor technology, design skill of the microstructures and nanostructures using advanced techniques of fabrication.

Prerequisites

no

Co-requisites

Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

[1] H.O. Pierson, Handbook of Chemical Vapor Deposition. William Andrew Publishing, LLC Norwish, NY, USA, (EN)
1999, ISBN 0-8155-1432-8 (EN)
[2] S. Sivaram, Chemical Vapor Deposition. International Thomson Publishing Inc., 1995, ISBN 0-442-01079-6 (EN)
[3] M.A. Reed and T. Lee, Molecular Nanoelectronics. American Scientific Publisher, 2003, ISBN 1-58883-006-3 (EN)
[4] MEMS and Nanotechnology Clearinghouse, http://www.memsnet.org (EN)
[5] Courtesy Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov (EN)
[6] Michael Kraft: Micromachined Inertial Sensors Recent Developments at BSAC, prezentace, Berkeley Sensor (EN)
&Actuator Center, California,USA (EN)
[7] C.T. Leondes, MEMS/NEMS Handbook: Techniques and Applications, Vol. 1-5. Springer Science, 2006 (EN)
[8] H.S. Nalez, Handbook of Organic-Inorganic Hybrid Materials and Nanocoposities, Vol. 1-2, American Scientific (EN)
Publisher, 2003. (EN)
[9] TJ. Coutts, Active and Passive Thin Film Device. Academic Press, London 1978, pp.1-858 (EN)

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Oral exam of the subject will be performed in a present form.

Language of instruction

Czech

Work placements

Not applicable.

Course curriculum

1. Introduction to microtechnologies (PVD, CVD, micromachining, sandwich structures)
2. Physical Vapor Deposition (thermal evaporation, DC-, ion-, magnetron-, RF-, and reactive sputtering)
3. Chemical Vapor Deposition (LPCVD, MOCVD, epitaxy, ALD, PECVD, diffusion of dopants)
4. Preparation of wafers (polishing, cleaning, piranha, SC1, SC2)
5. Photolithography and resist preparation (resist coating, exposure, development and removal, mask preparation)
6. Wet etching (isotropic and anisotropic etching)
7. Dry etching (ion etching, RIE, DRIE, FIB)
8. Passivation films
9. Selected processes (Lift-off process, League process, Locos process)
10. MEMS technology (volume and surface micromachining, accelerometer and gyroscope construction)
11. MOS technology (basic structure, capacitor, diode, N-MOS, P-MOS, CMOS)
12. Nanotechnology in microelectronics

Aims

Student is going to familiarize with the elemental and advanced methods and techniques for the microstructures and semiconductor devices fabrication, with materials, rules for their creation and modern nanotechnologies in semiconductor industry.

Classification of course in study plans

  • Programme EKT-PK Doctoral

    branch PK-BEB , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-BEB , 1. year of study, summer semester, 4 credits, optional specialized
    branch PP-KAM , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-KAM , 1. year of study, summer semester, 4 credits, optional specialized
    branch PK-EST , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-EST , 1. year of study, summer semester, 4 credits, optional specialized
    branch PP-MVE , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-MVE , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-MET , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-MET , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-FEN , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-FEN , 1. year of study, summer semester, 4 credits, optional specialized
    branch PK-SEE , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-SEE , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-TLI , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-TLI , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PK Doctoral

    branch PK-TEE , 1. year of study, summer semester, 4 credits, optional specialized

  • Programme EKT-PP Doctoral

    branch PP-TEE , 1. year of study, summer semester, 4 credits, optional specialized

Type of course unit

 

Seminar

39 hours, optionally

Teacher / Lecturer