Microelectronics and Assembly Technology
FEKT-CMTSAcad. year: 2019/2020
The subject deals with development of microelectronic passive and active components including interconnection and packaging. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits and new performances of semiconductor as MCM, CSP, Flip Chip etc.
Learning outcomes of the course unit
Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.
The subject knowledge on the secondary school education level is requested.
Recommended optional programme components
Recommended or required reading
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)
SZENDIUCH, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2002. ISBN 80-214-2072-3 (CS)
Tummala,R.: Fundamentals of Microsystems Packaging, McGraw-Hill, NewYork, ISBN 0-07-1371699 (EN)
Planned learning activities and teaching methods
Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.
Assesment methods and criteria linked to learning outcomes
Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.
Language of instruction
To dive for students knowledge about technology of microelectronics components, circuits and systems
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.