Course detail

New Technology for Microelectronic Circuits

FEKT-MMTEAcad. year: 2019/2020

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Low Temperature |Cofired Ceramics are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in PhD degree study.

Learning outcomes of the course unit

The student is able to take decision about basic principles in design and production of electronics circuits, equipments and systems


The subject knowledge on the Bachelor´s degree level is requested.


Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

Szendiuch, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)
Szendiuch,I.: Education in Hybrid Microelectronics at the Technical University of Brno,Microelectronics, Interconnection and Assembly Book, Kluwer Academic Publ. (CS)
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (kniha) ISBN 80-214-0901-0 (CS)
Tummala, R.: Fundamentals of Microsystems Pacakaging, McGraw-Hill, New York, 2001, ISBN 0-07-137169- (EN)
Charles A Harper : Handbook of thick film hybrid microelectronics, McGraw-Hill, New York, 1974, ISBN 0-07-026680-8 (EN)
Abel, M., Cimburek, V.: Bezolovnaté pájení v legislativě i praxi, ABE.TEC, Pardubice, 2005, ISBN 80-903597-0-1 (CS)

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Laboratory : 12p
HIO design: 8p
Written and oral exam: 80 p

The exam from the subject will be realized personally and distantly.

Language of instruction


Work placements

Not applicable.

Course curriculum

Syllabus of lectures:

1. Introduction to design and technology of electrical circuits (packaging and interconnection)
2. Thick-film technology I - (materials)
3. Thick film technology II - (processes)
4. Vacuum technologies and mass operations on chips
5. Assembly and interconnection of semiconductor chips, packaging
6. ESD - Electrostatic discharge
7. Modern electronic packages QFN and BGA
8. Legislation, EcoDesign and human health
9. Quality and reliability in electrical engineering
10. Practical view to repairs of electronic assemblies


To give a future engineers knowledge about new principles of design, assembly, production and maintenance of electronic circuits, equipments and systems, so that they will be able to join research, development and production subjects, and also to continue in the scientific activities.

Specification of controlled education, way of implementation and compensation for absences

Laboratory - design, implementation and testing of modern components:

1. Hybrid integrated circuit design
2. Realization of hybrid integrated circuit
3. Packaging and interconnection of microelectronic structures
4. Soldering of complex electronic packages
5. Production of LTCC structures

Classification of course in study plans

  • Programme EEKR-M1 Master's

    branch M1-EST , 1. year of study, summer semester, 6 credits, optional interdisciplinary
    branch M1-MEL , 2. year of study, summer semester, 6 credits, optional specialized

  • Programme EEKR-CZV lifelong learning

    branch ET-CZV , 1. year of study, summer semester, 6 credits, optional specialized

Type of course unit



39 hours, optionally

Teacher / Lecturer