Course detail

Microelectronics and Assembly Technology

FEKT-BPC-MTSAcad. year: 2019/2020

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.

Learning outcomes of the course unit

Basic knowledge and orientation in the field of design and manufacture of modern electronic circuits, devices and systems (hardware), which will enable the student to define, describe and also explain and possibly calculate basic parameters from the above mentioned problems.

Student after passing the subject:
1. Enables the basic issues of electronic hardware, its importance, its composition and its basic use
2. Understand and explain the basic nature of individual electronic components and describe their principles of implementation and use
3. Explains the theoretical function of basic hardware components and identifies its most commonly used types, names their parameters in relation to use in various applications
4. Is able to design hybrid integrated circuits, demonstrate and clarify the basic principles of their implementation and execution
5. Undertakes or supports an opinion on its own application in manufacturing, service and design institutions in the field of microelectronics and electrotechnics, and also develops basic prerequisites for master's studies

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

Szendiuch,I.: Mikroelektronika a technologien součástek, Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3 (CS)
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)
Szendiuch, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)
Tummala, R.: Fundamentals of Microsystems Pacakaging, McGraw-Hill, New York, 2001, ISBN 0-07-137169- (EN)

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations. There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every year.

Language of instruction

Czech

Work placements

Not applicable.

Course curriculum

1. Introduction to microelectronic technologies.
2. Thick film technology.
3. Semiconductor chips and integrated circuits.
4. Passive components.
5. Interconnection in microelectronics.
6. Packaging and thermal management of integrated circuits.
7. Assembly and surface mount technology.
8. Soldering profiles setting depending on the chosen soldering method.
9. Quality managementin electronic production and legislation.
10. Ecodesign and human health, ecological design of electrotechnical products.

Aims

The goal is to introduce students to knowledge about technology of microelectronics components, circuits and systems, that they will be able to join praxis as well to continue in the master study.

Specification of controlled education, way of implementation and compensation for absences

Practical excercises are situated in Laboratory of microelectronic technologies and packaging, always in groups of maximum 6 students according to timetable set at the beginning of the semester. Compensation is possible only after personal agreement with teacher in exceptional cases (on the basis of a medical certificate).

Lab exercise :
1. Design of a hybrid integrated circuit.
2. Practical realization of hybrid integrated circuit.
3. Measurement of thick film resistors by four-wire method.
4. Trimming od thick film resistors and their statistical evaluation.
5. Soldering and measuring of temperature profiles.
6. Packaging and interconnection.

Classification of course in study plans

  • Programme BPC-MET Bachelor's, 3. year of study, winter semester, 6 credits, compulsory

  • Programme EEKR-CZV lifelong learning

    branch ET-CZV , 1. year of study, winter semester, 6 credits, compulsory

Type of course unit

 

Lecture

26 hours, optionally

Teacher / Lecturer

Exercise

12 hours, optionally

Teacher / Lecturer

The other activities

6 hours, optionally

Teacher / Lecturer

eLearning