Course detail

Physical Principles of the Semiconductor Technology

FSI-TP0Acad. year: 2018/2019

Individual steps in semiconductors production and device manufacturing - physics and chemistry models

Learning outcomes of the course unit

The course provides knowledge of processes in semiconductors production


Solid State Physics, chemistry


Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

KERN, Werner. /Handbook of Semiconductor Wafer Cleaning Technology:Science, Technology, and Applications/. New Jersey, U.S.A.: Noyes Publications, 1993. 623 s
KITTEL, Charles. /Úvod do fyziky pevných látek : Introduction to solid state physics (Orig.)/. 1. vyd. Praha: Academia, 1985. 598 s
WOLF, Stanley a Richard N. TAUBER. /Silicon Processing for the VLSI Era/. Sunset Beach, California, U.S.A.: Lattice Press, 1999. 960 s. Vol. 1: Process Technology

Planned learning activities and teaching methods

The course is taught through lectures explaining the basic principles and theory of the discipline.

Assesment methods and criteria linked to learning outcomes

Colloquium and a brief final report on the problem solution.

Language of instruction


Work placements

Not applicable.


The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models

Classification of course in study plans

  • Programme B3A-P Bachelor's

    branch B-FIN , 3. year of study, winter semester, 2 credits, elective (voluntary)

  • Programme M2A-P Master's

    branch M-FIN , 1. year of study, winter semester, 2 credits, elective (voluntary)
    branch M-FIN , 2. year of study, winter semester, 2 credits, elective (voluntary)

Type of course unit



39 hours, optionally

Teacher / Lecturer


The following topics will be covered:
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry