Course detail

Microelectronics and Assembly Technology

FEKT-KMTSAcad. year: 2017/2018

The subject deals with development of modern microelectronic components (hardware) with impact on passive and active components including their integration in contex with interconnection and packaging. There are described film technologies and surface mount technologies as well new performances of semiconductor as well as new modern solutions for packaging, for example multi chip moduled (MCM), chip scale packagec (CSP), Flip Chips, wafer level packaging (WLP) moving to 3D. On the base of practical use there are involved also selected parts from quality and environmental management joined to microelectronics technologies. The subject offers summary in electronics hardware, from its design to applications. That gives to students to lern and understand this matter for practical use as well for developing the knowledge in the following education process.

Learning outcomes of the course unit

Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)
Szendiuch, I.: Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2002. ISBN 80-214-2072-3 (CS)
Szendiuch, I.: Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)
Haskard,M.: Electronic Circuit Cards and Surface Mount Technology, Technical Reference Publications LTD, Bristol, 19 (EN)

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations. There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Language of instruction

Czech

Work placements

Not applicable.

Aims

To dive for students knowledge about technology of microelectronics components, circuits and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Classification of course in study plans

  • Programme EEKR-BK Bachelor's

    branch BK-MET , 3. year of study, winter semester, 6 credits, compulsory

  • Programme EEKR-CZV lifelong learning

    branch ET-CZV , 1. year of study, winter semester, 6 credits, compulsory

Type of course unit

 

Lecture

39 hours, optionally

Teacher / Lecturer

Laboratory exercise

26 hours, compulsory

Teacher / Lecturer