Course detail

Microelectronics and Assembly Technology

FEKT-BMTSAcad. year: 2015/2016

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.

Learning outcomes of the course unit

Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Recommended optional programme components

Not applicable.

Recommended or required reading

Szendiuch,I.: Mikroelektronika a technologien součástek, Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3 (CS)
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)
Szendiuch, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)
Tummala, R.: Fundamentals of Microsystems Pacakaging, McGraw-Hill, New York, 2001, ISBN 0-07-137169- (EN)

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations. There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Language of instruction

Czech

Work placements

Not applicable.

Aims

To give for students knowledge about technology of microelectronics components, circuits and systems, that they will be able to join praxis as well to continue in the master study.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Classification of course in study plans

  • Programme EEKR-B Bachelor's

    branch B-EST , 3. year of study, winter semester, 6 credits, optional interdisciplinary
    branch B-MET , 3. year of study, winter semester, 6 credits, compulsory

  • Programme EEKR-CZV lifelong learning

    branch ET-CZV , 1. year of study, winter semester, 6 credits, compulsory

Type of course unit

 

Lecture

39 hours, optionally

Teacher / Lecturer

Laboratory exercise

26 hours, compulsory

Teacher / Lecturer