Czech

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Fundamental properties of plasma state and presents methodology of plasma chemistry. Plasma applications in material sciences, microelectronics, biology, and polymer, organic, inorganic and analytical chemistries.

Physical chemistry - thermodynamics, kinetics.
Physics - mass point motion, electric field and current, magnetic field
Mathematics - differential equations

Not applicable.

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Spoken examen.

1. Plasma thermodynamics and kinetics
Plasma in thermodynamic equilibrium and disequilibrium, Non-isothermic plasma.
Basic collision processes, cross sections, distribution functions.
Boltzmann kinetic equation, basic transport processes in plasma.
Inner and outer plasma parameters.

2. Elementary and chemical processes in plasmas
Electron, vibrational and rotation energy of molecules and population of the appropriate states.
Metastable states, sensibilized fluorescence and non-elastic collisions, pre-dissociation and dissociative recombination.
Mechanisms of ionization and recombination, chemiluminescence in plasma.

3. Plasma diagnostics
Spectral and optical methods, electronic, excitation, vibrational and rotational temperature.
Probe methods, floating and plasma potential, simple and double Langmuir probe.
Corpuscular methods, mass spectrometry, actinometry.

4. Laboratory plasma
Properties and generation of various laboratory plasmas (DC, AC, RF, MW discharges, corona, gliding and barrier discharges).
Plasma at high pressures (arc, plasmatron, spark, unipolar RF and MW discharges), RF discharges coupled capatively and inductively, matching networks, ECR plasma.

5. Plasma properties
Electric conductivity, diffusion and ambipolar diffusion, temperature and concentration of charged particles in various discharges; dielectric properties, permittivity, refraction index, interaction with electromagnetic field; conditions for ignition of the discharges, plasma as the spectral source (ICP).

6.-9. Plasmachemical processes
Rates of the reaction in plasmas, reaction coefficients.
Homogeneous, heterogeneous and homogeny-heterogeneous reactions. PE CVD and PA CVD methods.
Atomic oxygen reactions, creation of oxides, ozone generation, ozonizators, detection.
Atomic nitrogen reactions, Nitridation, surface nitridation, reactions in the post-discharges.
Atomic hydrogen reactions (a-Si:H), plasma etching, reactive ion etching, ion melting.
Plasma polymerization.
Surface hydrophilization and hydrophobization of various materials (polymers, textile, glass, semiconductors).
Grafting, increase of adhesivity and wettability, reactions of aliphatic and aromatic hydrocarbons in plasmas.
Siloxane and silazane reactions, protective coatings, semipermeabile membranes and selective sorption layers.
Magnetron (reactive) sputtering, hard and ultra hard coatings prepared by plasmachemical processes (diamond like layers, a-C:H, microcrystaline diamond thin layers, c-BN, TiN, AlN and nanocrystaline composites).
Plasma spraying, nanocrystalic powder materials, fullerenes, nanotubes.

10. Special kinds of plasma with participation of the chemical reactions
Chemical lasers, pulsed lasers, photodissociative lasers (ASTERIX), flat plasma displays.
Plasma created in the gas mixtures and amalgam vapors, Penning mixtures, plasma in the illumination technique.

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The lectures give an overview through the fundamental properties of plasma state and presents methodology of plasma chemistry so that students of chemical engineering can apply the unique physical characteristics of plasma to such fields as material sciences, microelectronics, biology, and polymer, organic, inorganic and analytical chemistries. In the lecture is represented a broad spectrum of applications that give special attention to those in which a nonequilibrium plasma (Te >> Tn) is used.

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ANDERS, A. Handbook of Plasma Ion Implantation and deposition, 1st ed., New York: John Wiley & Sons, 2000, ISBN 0-471-24698-0 (CS)
ROTH J.R. Industrial Plasma Engineering I. , II., London: CRC Press - Taylor & Francis Group, 1995, ISBN (Vol. 1): 978-0750303187, ISBN (Vol. 2): 978-0750303170 (CS)
SHUL, R.J., PEARTON, S.J. Handbook of Advanced Plasma Processing, 1st ed., Berlin: Springer, 2000, ISBN 978-3-642-56989-0 (CS)

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0 hours, optionally