Publication detail

Mechanical Stress of Chip SMD Components with Ceramic Body

ŠANDERA, J., HEJÁTKOVÁ, E.

Original Title

Mechanical Stress of Chip SMD Components with Ceramic Body

English Title

Mechanical Stress of Chip SMD Components with Ceramic Body

Type

conference paper

Language

en

Original Abstract

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

English abstract

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

RIV year

2003

Released

20.09.2003

Location

Brno, University of Technology

ISBN

80-214-2452-4

Book

Electronic Devices and Systems

Pages from

398

Pages to

402

Pages count

5

BibTex


@inproceedings{BUT9561,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Mechanical Stress of Chip SMD Components with Ceramic Body",
  annote="The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.",
  booktitle="Electronic Devices and Systems",
  chapter="9561",
  year="2003",
  month="september",
  pages="398",
  type="conference paper"
}