Publication detail

Experimental study of glass frit bonding

PEKÁREK, J. VRBA, R. PRÁŠEK, J. CHOMOUCKÁ, J.

Original Title

Experimental study of glass frit bonding

English Title

Experimental study of glass frit bonding

Type

conference paper

Language

en

Original Abstract

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

English abstract

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

Keywords

Glass frit, wafer bonding

RIV year

2012

Released

30.05.2012

Publisher

Mendelova univerzita v Brně

Location

Brno

ISBN

978-80-7375-618-5

Book

XII. Pracovní setkání fyzikálních chemiků a elektrochemiků

Edition number

1.

Pages from

214

Pages to

215

Pages count

2

BibTex


@inproceedings{BUT92579,
  author="Jan {Pekárek} and Radimír {Vrba} and Jan {Prášek} and Jana {Pekárková}",
  title="Experimental study of glass frit bonding",
  annote="Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.",
  address="Mendelova univerzita v Brně",
  booktitle="XII. Pracovní setkání fyzikálních chemiků a elektrochemiků",
  chapter="92579",
  howpublished="print",
  institution="Mendelova univerzita v Brně",
  year="2012",
  month="may",
  pages="214--215",
  publisher="Mendelova univerzita v Brně",
  type="conference paper"
}