Publication detail

Testing of Novel Device for Anodic Bonding process in MEMS Application

PEKÁREK, J. VRBA, R. MAGÁT, M. PAVLÍK, M. HÁZE, J.

Original Title

Testing of Novel Device for Anodic Bonding process in MEMS Application

English Title

Testing of Novel Device for Anodic Bonding process in MEMS Application

Type

journal article in Web of Science

Language

en

Original Abstract

The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass

English abstract

The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass

Keywords

Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test.

RIV year

2011

Released

16.09.2011

Publisher

Faculty of Electronic Engineering and Technologies, Technical University of Sofia

Location

Sofia

Pages from

180

Pages to

182

Pages count

3

BibTex


@article{BUT73584,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát} and Michal {Pavlík} and Jiří {Háze}",
  title="Testing of Novel Device for Anodic Bonding process in MEMS Application",
  annote="The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass",
  address="Faculty of Electronic Engineering and Technologies, Technical University of Sofia",
  chapter="73584",
  institution="Faculty of Electronic Engineering and Technologies, Technical University of Sofia",
  journal="Annual Journal of Electronics",
  number="2",
  volume="5",
  year="2011",
  month="september",
  pages="180--182",
  publisher="Faculty of Electronic Engineering and Technologies, Technical University of Sofia",
  type="journal article in Web of Science"
}