Publication detail

Influence of the CTE on Mechanical Stress of Chip SMD Components

ŠANDERA, J., HEJÁTKOVÁ, E.

Original Title

Influence of the CTE on Mechanical Stress of Chip SMD Components

English Title

Influence of the CTE on Mechanical Stress of Chip SMD Components

Type

conference paper

Language

en

Original Abstract

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

English abstract

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Keywords

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

RIV year

2002

Released

01.01.2002

Location

Brno

ISBN

80-214-2217-3

Book

Socrates Workshop 2002 - Proceedings

Edition number

1.

Pages from

92

Pages to

96

Pages count

5

BibTex


@inproceedings{BUT5119,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Influence of the CTE on Mechanical Stress of Chip SMD Components",
  annote="This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.",
  booktitle="Socrates Workshop 2002 - Proceedings",
  chapter="5119",
  year="2002",
  month="january",
  pages="92",
  type="conference paper"
}