Publication detail
New Facts from Lead-free Solders Reliability Investigation
BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. HEJÁTKOVÁ, E.
Original Title
New Facts from Lead-free Solders Reliability Investigation
English Title
New Facts from Lead-free Solders Reliability Investigation
Type
conference paper
Language
en
Original Abstract
The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.
English abstract
The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.
Keywords
Lead-free, reliability, solder, structure
RIV year
2010
Released
13.09.2010
Location
Berlín, Německo
ISBN
978-1-4244-8555-0
Book
Electronics System Integration Technology Conference ESTC 2010 in Berlin
Edition
1
Edition number
1
Pages from
101
Pages to
105
Pages count
5
Documents
BibTex
@inproceedings{BUT35244,
author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
title="New Facts from Lead-free Solders Reliability Investigation",
annote="The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.",
booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
chapter="35244",
edition="1",
howpublished="print",
year="2010",
month="september",
pages="101--105",
type="conference paper"
}