Publication detail

Testing and Simulation of Wire Bonding Attach for higher Current

BURŠÍK, M. NOVOTNÝ, M. JANKOVSKÝ, J. HEJÁTKOVÁ, E. SZENDIUCH, I.

Original Title

Testing and Simulation of Wire Bonding Attach for higher Current

English Title

Testing and Simulation of Wire Bonding Attach for higher Current

Type

conference paper

Language

en

Original Abstract

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

English abstract

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

Keywords

Testing, current load, wire bonding, simulation

RIV year

2010

Released

13.09.2010

Location

Berlín, Německo

ISBN

978-1-4244-8555-0

Book

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edition

1

Edition number

1

Pages from

1

Pages to

4

Pages count

4

Documents

BibTex 


@inproceedings{BUT35243,
  author="Martin {Buršík} and Marek {Novotný} and Jaroslav {Jankovský} and Edita {Hejátková} and Ivan {Szendiuch}",
  title="Testing and Simulation of Wire Bonding Attach for higher Current",
  annote="This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for
standard CMOS technology.",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  chapter="35243",
  edition="1",
  howpublished="electronic, physical medium",
  year="2010",
  month="september",
  pages="1--4",
  type="conference paper"
}