Publication detail
Testing and Simulation of Wire Bonding Attach for higher Current
BURŠÍK, M. NOVOTNÝ, M. JANKOVSKÝ, J. HEJÁTKOVÁ, E. SZENDIUCH, I.
Original Title
Testing and Simulation of Wire Bonding Attach for higher Current
English Title
Testing and Simulation of Wire Bonding Attach for higher Current
Type
conference paper
Language
en
Original Abstract
This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.
English abstract
This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.
Keywords
Testing, current load, wire bonding, simulation
RIV year
2010
Released
13.09.2010
Location
Berlín, Německo
ISBN
978-1-4244-8555-0
Book
Electronics System Integration Technology Conference ESTC 2010 in Berlin
Edition
1
Edition number
1
Pages from
1
Pages to
4
Pages count
4
Documents
BibTex
@inproceedings{BUT35243,
author="Martin {Buršík} and Marek {Novotný} and Jaroslav {Jankovský} and Edita {Hejátková} and Ivan {Szendiuch}",
title="Testing and Simulation of Wire Bonding Attach for higher Current",
annote="This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for
standard CMOS technology.",
booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
chapter="35243",
edition="1",
howpublished="electronic, physical medium",
year="2010",
month="september",
pages="1--4",
type="conference paper"
}