Publication detail

The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle

POMANTE, L. MUTTILLO, V. KŘENA, B. VOJNAR, T. VELJKOVIĆ, F. MAGNIN, P. MATSCHNIG, M. FISCHER, B. MARTINEZ, J. GRUBER, T.

Original Title

The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle

Type

journal article in Web of Science

Language

English

Original Abstract

There is an ever-increasing complexity of the systems we engineer in modern society, which includes facing the convergence of the embedded world and the open world. This complexity creates increasing difficulty with providing assurance for factors including safety, security and performance. In such a context, the AQUAS project investigates the challenges arising from e.g., the inter-dependence of safety, security and performance of systems and aims at efficient solutions for the entire product life-cycle. The project builds on knowledge of partners gained in current or former EU projects and will demonstrate the newly developed methods and techniques for co-engineering across use cases spanning Aerospace, Medicine, Transport and Industrial Control.

Keywords

Cyber-physical systems, Safety, Security, Performance, Co-engineering, Product life-cycle

Authors

POMANTE, L.; MUTTILLO, V.; KŘENA, B.; VOJNAR, T.; VELJKOVIĆ, F.; MAGNIN, P.; MATSCHNIG, M.; FISCHER, B.; MARTINEZ, J.; GRUBER, T.

Released

1. 9. 2019

ISBN

0141-9331

Periodical

Microprocessors and Microsystems

Year of study

2019

Number

69

State

Kingdom of the Netherlands

Pages from

54

Pages to

67

Pages count

14

URL

BibTex

@article{BUT162302,
  author="POMANTE, L. and MUTTILLO, V. and KŘENA, B. and VOJNAR, T. and VELJKOVIĆ, F. and MAGNIN, P. and MATSCHNIG, M. and FISCHER, B. and MARTINEZ, J. and GRUBER, T.",
  title="The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle",
  journal="Microprocessors and Microsystems",
  year="2019",
  volume="2019",
  number="69",
  pages="54--67",
  doi="10.1016/j.micpro.2019.05.013",
  issn="0141-9331",
  url="https://www.sciencedirect.com/science/article/pii/S014193311930047X"
}