Publication detail

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

MAKKI, Z. JANDA, M.

Original Title

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

English Title

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

Type

conference paper

Language

Czech

Original Abstract

The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.

English abstract

The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.

Keywords

Ansys Icepak, PCB (Printed circuit board), Heat conduction, Heat spread

Key words in English

Ansys Icepak, PCB (Printed circuit board), Heat conduction, Heat spread

Authors

MAKKI, Z.; JANDA, M.

RIV year

2014

Released

25. 6. 2014

Location

Jasná, Slovak Republic

ISBN

978-80-905525-1-7

Book

22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014

Edition number

1

Pages from

114

Pages to

118

Pages count

172

BibTex

@inproceedings{BUT109897,
  author="Zbyněk {Makki} and Marcel {Janda}",
  title="REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD",
  booktitle="22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014",
  year="2014",
  number="1",
  pages="114--118",
  address="Jasná, Slovak 
Republic",
  isbn="978-80-905525-1-7"
}