Publication detail

Optimization of ceramics bonding in the area of pressure sensor manufacturing

NOVOTNÝ, R. VLACH, R. KADLEC, J. KUCHTA, R.

Original Title

Optimization of ceramics bonding in the area of pressure sensor manufacturing

English Title

Optimization of ceramics bonding in the area of pressure sensor manufacturing

Type

journal article in Web of Science

Language

en

Original Abstract

Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved.

English abstract

Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved.

Keywords

ceramic, bonding, pressure, sensor, joint, technology

RIV year

2013

Released

01.04.2014

Pages from

719

Pages to

728

Pages count

10

BibTex


@article{BUT103717,
  author="Radovan {Novotný} and Radek {Vlach} and Jaroslav {Kadlec} and Radek {Kuchta}",
  title="Optimization of ceramics bonding in the area of pressure sensor manufacturing",
  annote="Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining 
and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are 
evaluated by using a t-test before and after process cooling modification. Important directions for future research are 
summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification 
of joint technology and process setting affects results and parameters that have been achieved.",
  chapter="103717",
  doi="10.1007/s00542-013-2013-7",
  number="4-5",
  volume="20",
  year="2014",
  month="april",
  pages="719--728",
  type="journal article in Web of Science"
}