Publication detail

Board on Board New PCB Configuration Moving in 3D Packaging

SZENDIUCH, I. PSOTA, B. OTÁHAL, A. HEJÁTKOVÁ, E.

Original Title

Board on Board New PCB Configuration Moving in 3D Packaging

English Title

Board on Board New PCB Configuration Moving in 3D Packaging

Type

conference paper

Language

en

Original Abstract

This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.

English abstract

This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.

Keywords

PCB, 3D packaging, reliability, vibration testing, ANSYS

RIV year

2013

Released

26.06.2013

Publisher

Novapress sro

Location

Vysoké učení technické v Brně

ISBN

978-80-214-4754-7

Book

THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013

Pages from

224

Pages to

227

Pages count

4

BibTex


@inproceedings{BUT100943,
  author="Ivan {Szendiuch} and Boleslav {Psota} and Alexandr {Otáhal} and Edita {Hejátková}",
  title="Board on Board New PCB Configuration Moving in 3D Packaging",
  annote="This paper describes the main idea of EURIPIDES project Board on Board (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will also be highly desired. Main principle and approach is described in this paper.",
  address="Novapress sro",
  booktitle="THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013",
  chapter="100943",
  howpublished="print",
  institution="Novapress sro",
  year="2013",
  month="june",
  pages="224--227",
  publisher="Novapress sro",
  type="conference paper"
}