Publication detail

Wire-Bonds Durability in High-Temperature Applications

KLÍMA, M. PSOTA, B. SZENDIUCH, I.

Original Title

Wire-Bonds Durability in High-Temperature Applications

English Title

Wire-Bonds Durability in High-Temperature Applications

Type

conference paper

Language

en

Original Abstract

This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.

English abstract

This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.

Keywords

wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic

RIV year

2013

Released

26.06.2013

Publisher

VUT

Location

Brno

ISBN

978-80-214-4754-7

Book

Electronic Devices and Systems - IMAPS CS International Conference 2013

Edition

first

Edition number

1

Pages from

38

Pages to

43

Pages count

6

BibTex


@inproceedings{BUT99660,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Wire-Bonds Durability in High-Temperature Applications",
  annote="This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.",
  address="VUT",
  booktitle="Electronic Devices and Systems - IMAPS CS International Conference 2013",
  chapter="99660",
  edition="first",
  howpublished="print",
  institution="VUT",
  year="2013",
  month="june",
  pages="38--43",
  publisher="VUT",
  type="conference paper"
}