Publication detail

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

NICÁK, M. ŠANDERA, J. STARÝ, J. KOSINA, P. PSOTA, B.

Original Title

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

English Title

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Type

journal article - other

Language

en

Original Abstract

This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).

English abstract

This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).

Keywords

Packaging, 3D, LTCC, soldering

RIV year

2012

Released

31.12.2012

Publisher

Fakulta Elektrotechnická ZČU v Plzni

Location

Plzeň

Pages from

1

Pages to

5

Pages count

5

URL

BibTex


@article{BUT96473,
  author="Michal {Nicák} and Josef {Šandera} and Jiří {Starý} and Petr {Kosina} and Boleslav {Psota}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  annote="This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).",
  address="Fakulta Elektrotechnická ZČU v Plzni",
  chapter="96473",
  institution="Fakulta Elektrotechnická ZČU v Plzni",
  number="VI.",
  volume="2012",
  year="2012",
  month="december",
  pages="1--5",
  publisher="Fakulta Elektrotechnická ZČU v Plzni",
  type="journal article - other"
}