Publication detail

The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

ADÁMEK, M. SCHNEDERLE, P. SZENDIUCH, I. LIPAVSKÝ, L.

Original Title

The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

English Title

The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

Type

conference paper

Language

en

Original Abstract

Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.

English abstract

Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.

Keywords

Solder joints, ceramic, wetting angle, shear test.

RIV year

2012

Released

17.09.2012

Publisher

Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium

Location

Amsterdam, NL

ISBN

978-1-4673-4644-3

Book

4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012

Edition

1

Edition number

1

Pages from

1

Pages to

5

Pages count

5

URL

BibTex


@inproceedings{BUT95822,
  author="Martin {Adámek} and Petr {Schnederle} and Ivan {Szendiuch} and Lubomír {Lipavský}",
  title="The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates",
  annote="Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints.
This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate.
This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.",
  address="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  booktitle="4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012",
  chapter="95822",
  edition="1",
  howpublished="electronic, physical medium",
  institution="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  year="2012",
  month="september",
  pages="1--5",
  publisher="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  type="conference paper"
}