Publication detail

Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

ŠVECOVÁ, O. ŠANDERA, J. KOSINA, P. SZENDIUCH, I.

Original Title

Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

English Title

Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

Type

conference paper

Language

en

Original Abstract

The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printed circuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assemblies were subject to thermal and mechanical stress in the thermal chamber.

English abstract

The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printed circuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assemblies were subject to thermal and mechanical stress in the thermal chamber.

Keywords

Lead-free solder, solder joint, ANSYS, reliability

RIV year

2011

Released

15.09.2011

Location

Brihton, UK

ISBN

978-0-9568086-0-8

Book

18th European microelectronics packaging conference EMPC 2011 - Proceedings

Edition

1

Edition number

1

Pages from

210

Pages to

214

Pages count

5

BibTex


@inproceedings{BUT89466,
  author="Olga {Švecová} and Josef {Šandera} and Petr {Kosina} and Ivan {Szendiuch}",
  title="Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints",
  annote="The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment.
In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printed circuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model.
To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assemblies were subject to thermal and mechanical stress in the thermal chamber.",
  booktitle="18th European microelectronics packaging conference EMPC 2011 - Proceedings",
  chapter="89466",
  edition="1",
  howpublished="print",
  year="2011",
  month="september",
  pages="210--214",
  type="conference paper"
}