Publication detail

Thick Film Planar Inductor Characterization

PULEC, J. SZENDIUCH, I.

Original Title

Thick Film Planar Inductor Characterization

English Title

Thick Film Planar Inductor Characterization

Type

conference paper

Language

en

Original Abstract

Paper describes experiment where model of thick film inductor was created, simulated and verified. For simulation, the FEM (Finite Element Method) was used. In this paper are shown graphical outputs of simulation. Next part of this work was experimental verifying of obtained results. For this, testing sample was designed, manufactured and measured. Measured values were statistically evaluated.

English abstract

Paper describes experiment where model of thick film inductor was created, simulated and verified. For simulation, the FEM (Finite Element Method) was used. In this paper are shown graphical outputs of simulation. Next part of this work was experimental verifying of obtained results. For this, testing sample was designed, manufactured and measured. Measured values were statistically evaluated.

Keywords

Planar inductor, Inductance, Magnetic field, Numerical modeling

RIV year

2011

Released

12.09.2011

Publisher

IMAPS-Europe

Location

Brighton, UK

ISBN

978-0-9568086-0-8

Book

Proceedings of 18th European microelectronics packaging conference EMPC 2011

Pages from

458

Pages to

461

Pages count

4

URL

http://www.citizen-testdomain.co.uk/technical-conference/

Documents

BibTex 


@inproceedings{BUT74966,
  author="Jiří {Pulec} and Ivan {Szendiuch}",
  title="Thick Film Planar Inductor Characterization",
  annote="Paper describes experiment where model of thick film inductor was created, simulated and verified. For simulation, the FEM (Finite Element Method) was used. In this paper are shown graphical outputs of simulation. Next part of this work was experimental verifying of obtained results. For this, testing sample was designed, manufactured and measured. Measured values were statistically evaluated.",
  address="IMAPS-Europe",
  booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
  chapter="74966",
  howpublished="electronic, physical medium",
  institution="IMAPS-Europe",
  year="2011",
  month="september",
  pages="458--461",
  publisher="IMAPS-Europe",
  type="conference paper"
}