Publication detail

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

NICÁK, M. ŠVECOVÁ, O. PULEC, J. ŠANDERA, J. SZENDIUCH, I.

Original Title

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

English Title

Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures

Type

abstract

Language

en

Original Abstract

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

English abstract

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Keywords

Reliability, Lead-free, Solder ball, 3D

Released

28.06.2010

Publisher

VUT Brno, FSI & Repropress, Srbská 53, Brno

Location

Brno

ISBN

978-80-214-4112-5

Book

6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet

Edition

1

Pages from

184

Pages to

184

Pages count

1

BibTex


@misc{BUT61103,
  author="Michal {Nicák} and Olga {Švecová} and Jiří {Pulec} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Reliability and Simulation of Lead-free Solder Joint Behavior in 3D Packaging Structures",
  annote="This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.",
  address="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  booktitle="6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet",
  chapter="61103",
  edition="1",
  institution="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  year="2010",
  month="june",
  pages="184--184",
  publisher="VUT Brno, FSI & Repropress, Srbská 53, Brno",
  type="abstract"
}