Publication detail

Environment-friendly LF Solder SAC 305 and Its Reliability

ŠVECOVÁ, O. ŠANDERA, J.

Original Title

Environment-friendly LF Solder SAC 305 and Its Reliability

English Title

Environment-friendly LF Solder SAC 305 and Its Reliability

Type

abstract

Language

en

Original Abstract

The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.

English abstract

The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.

Keywords

Lead-free solder, solder joint, reliability, Weibull distribution

Released

13.05.2009

Publisher

Novpress s.r.o.

Location

Brno

ISBN

978-80-214-3874-3

Book

ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.

Edition number

1

Pages from

200

Pages to

201

Pages count

2

BibTex


@misc{BUT60592,
  author="Olga {Švecová} and Josef {Šandera}",
  title="Environment-friendly LF Solder SAC 305 and Its Reliability",
  annote="The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.",
  address="Novpress s.r.o.",
  booktitle="ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.",
  chapter="60592",
  institution="Novpress s.r.o.",
  year="2009",
  month="may",
  pages="200--201",
  publisher="Novpress s.r.o.",
  type="abstract"
}