Publication detail

Chybí název

BULVA, J., SZENDIUCH, I.

Original Title

Chybí název

English Title

Chybí název

Type

abstract

Language

en

Original Abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).

English abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).

Released

02.02.2005

Publisher

Universitat Rovira i Virgili

Location

Tarragona

Pages from

141

Pages to

141

Pages count

1

BibTex


@misc{BUT60034,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Chybí název",
  annote="This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices  FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).",
  address="Universitat Rovira i Virgili",
  booktitle="5a Conferencia de Dispositivos Electrónicos",
  chapter="60034",
  institution="Universitat Rovira i Virgili",
  journal="Nezařazené články",
  year="2005",
  month="february",
  pages="141",
  publisher="Universitat Rovira i Virgili",
  type="abstract"
}