Publication detail

Development in Electronic Packaging - Moving to 3D System Configuration

SZENDIUCH, I.

Original Title

Development in Electronic Packaging - Moving to 3D System Configuration

English Title

Development in Electronic Packaging - Moving to 3D System Configuration

Type

journal article

Language

en

Original Abstract

There is described development in the electronics packaging, which moving towards 3D configurations.

English abstract

There is described development in the electronics packaging, which moving towards 3D configurations.

Keywords

packaging, 3D structures, interconnection

RIV year

2011

Released

01.04.2011

Publisher

Czech and Slovak Universities

Location

Czech Republic

Pages from

214

Pages to

220

Pages count

7

BibTex


@article{BUT50420,
  author="Ivan {Szendiuch}",
  title="Development in Electronic Packaging - Moving to 3D System Configuration",
  annote="There is described development in the electronics packaging, which moving towards 3D configurations.",
  address="Czech and Slovak Universities",
  chapter="50420",
  institution="Czech and Slovak Universities",
  number="1",
  volume="April 2011",
  year="2011",
  month="april",
  pages="214--220",
  publisher="Czech and Slovak Universities",
  type="journal article"
}