Publication detail

Trends in Packaging and Lead-free Solders

SZENDIUCH, I.

Original Title

Trends in Packaging and Lead-free Solders

Type

journal article - other

Language

English

Original Abstract

Modern Trend in Packaging with application of Pb-free solders are described in this paper

Keywords

Packaging and Interconnectin, Lead-free soldering

Authors

SZENDIUCH, I.

RIV year

2003

Released

22. 10. 2003

Publisher

SMT info konsorcium

Location

Brno

ISBN

1211-6947

Periodical

Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"

Year of study

2003

Number

43

State

Czech Republic

Pages from

3

Pages to

6

Pages count

4

BibTex

@article{BUT41776,
  author="Ivan {Szendiuch}",
  title="Trends in Packaging and Lead-free Solders",
  journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}",
  year="2003",
  volume="2003",
  number="43",
  pages="4",
  issn="1211-6947"
}