Publication detail

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M.

Original Title

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

English Title

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Type

conference paper

Language

Czech

Original Abstract

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

English abstract

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

Keywords

AL2O3, LTCC, FR-4, 3D, Lead-free

Authors

NICÁK, M.

RIV year

2010

Released

29. 4. 2010

Publisher

NOVPRESS

Location

Brno

ISBN

978-80-214-4079-1

Book

STUDENT EEICT 2010

Edition

1

Edition number

1

Pages from

231

Pages to

235

Pages count

5

URL

http://www.feec.vutbr.cz/EEICT/2010/sbornik/03-Doktorske_projekty/06-Mikroelektronika_a_technologie/12-xmeda.pdf

BibTex

@inproceedings{BUT30818,
  author="Michal {Nicák}",
  title="DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES",
  booktitle="STUDENT EEICT 2010",
  year="2010",
  series="1",
  number="1",
  pages="231--235",
  publisher="NOVPRESS",
  address="Brno",
  isbn="978-80-214-4079-1",
  url="http://www.feec.vutbr.cz/EEICT/2010/sbornik/03-Doktorske_projekty/06-Mikroelektronika_a_technologie/12-xmeda.pdf"
}