Publication detail

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Original Title

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Czech Title

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Language

cs

Original Abstract

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

Czech abstract

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

BibTex


@inproceedings{BUT30818,
  author="Michal {Nicák}",
  title="DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES",
  annote="This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.",
  address="NOVPRESS",
  booktitle="STUDENT EEICT 2010",
  chapter="30818",
  edition="1",
  howpublished="print",
  institution="NOVPRESS",
  year="2010",
  month="april",
  pages="231--235",
  publisher="NOVPRESS",
  type="conference paper"
}