Publication detail

Chip Power Interconnection

NOVOTNÝ, M. SZENDIUCH, I.

Original Title

Chip Power Interconnection

English Title

Chip Power Interconnection

Type

conference paper

Language

en

Original Abstract

This paper describes themomechanical modeling of chip interconnection.

English abstract

This paper describes themomechanical modeling of chip interconnection.

Keywords

wire bonding, stress, power

RIV year

2007

Released

01.01.2007

Publisher

TU of Cluj Napoca

Location

Napoca

ISBN

1-4244-1218-8

Book

Proceeding of 30th International Spring Seminar on Electronics Technology

Edition number

první

Pages from

183

Pages to

186

Pages count

4

BibTex


@inproceedings{BUT22762,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Chip Power Interconnection",
  annote="This paper describes themomechanical modeling of chip interconnection.",
  address="TU of Cluj Napoca",
  booktitle="Proceeding of 30th International Spring Seminar on Electronics Technology",
  chapter="22762",
  institution="TU of Cluj Napoca",
  year="2007",
  month="january",
  pages="183",
  publisher="TU of Cluj Napoca",
  type="conference paper"
}