Publication detail

Moderní trendy pouzdření v mikroelektronice

Szendiuch,I.

Original Title

Moderní trendy pouzdření v mikroelektronice

English Title

Modern Trends in Electronics Packaging

Type

conference paper

Language

Czech

Original Abstract

MSM a PoP jako nové směry ve vývoji moderních pouzder jsou popsány

English abstract

MSM and PoP as new trends in electronics packaging are described

Keywords

MSM, PoP, pouzdření

Key words in English

MSM, PoP, packaging

Authors

Szendiuch,I.

RIV year

2006

Released

17. 10. 2006

Publisher

SMT info konsorcium

Location

Brno

ISBN

1211-6947

Periodical

Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"

Year of study

2006

Number

55

State

Czech Republic

Pages from

26

Pages to

30

Pages count

5

BibTex

@inproceedings{BUT20175,
  author="Ivan {Szendiuch}",
  title="Moderní trendy pouzdření v mikroelektronice",
  booktitle="Pájení a tepelné procesy",
  year="2006",
  journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}",
  volume="2006",
  number="55",
  pages="5",
  publisher="SMT info konsorcium",
  address="Brno",
  issn="1211-6947"
}