Publication detail

Comparing of flip-chip and wire-bonding interconnection

Novotný M.,Jakubka L.,Szendiuch I.

Original Title

Comparing of flip-chip and wire-bonding interconnection

English Title

Comparing of flip-chip and wire-bonding interconnection

Type

conference paper

Language

en

Original Abstract

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

English abstract

This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.

Keywords

flip chip, wire bonding, ANSYS, termomechanical stress

RIV year

2006

Released

01.01.2006

Publisher

TU Dresden

Location

Dresden

ISBN

00-000-0000-0

Book

29th International Spring Seminar on Electronics Technology, ISSE 2006

Edition number

prvni

Pages from

67

Pages to

70

Pages count

4

BibTex


@inproceedings{BUT18686,
  author="Marek {Novotný} and Luboš {Jakubka} and Ivan {Szendiuch}",
  title="Comparing of flip-chip and wire-bonding interconnection",
  annote="This paper discusses the thermo-mechanical stress rising in solder joints and wire-bonding connection with the using the program ANSYS. It describes the occurence of stress as a result of thermal expansion coefficient being dependent on temperature. It pays attention especially to examining the stress in flip-chip and wire-bonding interconnection depending on various material properties of the samples in the different temperatures. The purpose is to define such a shape of the structure, so it is the most reliable considering the rising stress.",
  address="TU Dresden",
  booktitle="29th International Spring Seminar on Electronics Technology, ISSE 2006",
  chapter="18686",
  institution="TU Dresden",
  year="2006",
  month="january",
  pages="67",
  publisher="TU Dresden",
  type="conference paper"
}