Publication detail

Dynamic Element Matching for the Grounded Inductor Simulator Output Stage in Ultrasonic Distance Sensor Applications

VYKYDAL, L. LEDVINA, J. HORSKÝ, P.

Original Title

Dynamic Element Matching for the Grounded Inductor Simulator Output Stage in Ultrasonic Distance Sensor Applications

Type

journal article in Web of Science

Language

English

Original Abstract

This letter describes a new dynamic element matching (DEM) technique usable in a resonant circuit during reverberation measurement. Traditionally, DEM algorithms switch circuit elements during the operating cycle, which would inject periodic noise into such sensitive circuits and degrade parameters of the overall system. We describe a new approach that eliminates this problem by switching elements between operating cycles and processing results from multiple operation cycles. This new DEM technique is specifically targeted for use with a grounded inductor simulator in transformerless park assist sensors. The described DEM approach was verified using a test chip and a digital control implemented in a field-programmable gate array. Measurement results confirming performance of the described DEM approach are presented.

Keywords

Tuning; Inductance; Sensors; Inductors; Reverberation; Switches; Distance measurement

Authors

VYKYDAL, L.; LEDVINA, J.; HORSKÝ, P.

Released

29. 7. 2020

ISBN

2475-1472

Periodical

IEEE Sensors Letters

Year of study

4

Number

8

State

United States of America

Pages from

1

Pages to

4

Pages count

4

URL

https://ieeexplore.ieee.org/document/9152133

BibTex

@article{BUT165344,
  author="Lukáš {Vykydal} and Jan {Ledvina} and Pavel {Horský}",
  title="Dynamic Element Matching for the Grounded Inductor Simulator Output Stage in Ultrasonic Distance Sensor Applications",
  journal="IEEE Sensors Letters",
  year="2020",
  volume="4",
  number="8",
  pages="1--4",
  doi="10.1109/LSENS.2020.3012870",
  issn="2475-1472",
  url="https://ieeexplore.ieee.org/document/9152133"
}