Publication detail

Current Load of Thick-film Pastes for Power Applications

OTÁHAL, A. SKÁCEL, J. SZENDIUCH, I. JANKOVSKÝ, J.

Original Title

Current Load of Thick-film Pastes for Power Applications

English Title

Current Load of Thick-film Pastes for Power Applications

Type

conference paper

Language

en

Original Abstract

This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al 2 O 3 ). The electrical current load concerning the width of the conductive path was determined from the performed measurements. During the measuring process, the electrical current was rising by 0.1A per 10s increasing voltage and temperature. Conductive path widths from 0.20 - 0.65 in 0.05 mm steps were tested. The terminals on the samples were connected by two methods, mechanical and solder joints. Results showed that the thick-film path was working up to 550 °C, with the current load up to approximately 8.6A for mechanically connected terminals. Soldered terminals were loaded by up to 7.1A and its temperature increased to 350 °C. Both results were measured for 0.65 mm path width.

English abstract

This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al 2 O 3 ). The electrical current load concerning the width of the conductive path was determined from the performed measurements. During the measuring process, the electrical current was rising by 0.1A per 10s increasing voltage and temperature. Conductive path widths from 0.20 - 0.65 in 0.05 mm steps were tested. The terminals on the samples were connected by two methods, mechanical and solder joints. Results showed that the thick-film path was working up to 550 °C, with the current load up to approximately 8.6A for mechanically connected terminals. Soldered terminals were loaded by up to 7.1A and its temperature increased to 350 °C. Both results were measured for 0.65 mm path width.

Keywords

alumina, ceramic packaging, conductors, electric current, reliability, silver, silver alloys, soldering

Released

19.06.2020

Publisher

IEEE

ISBN

978-1-7281-6773-2

Book

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

Pages from

1

Pages to

6

Pages count

6

URL

Documents

BibTex


@inproceedings{BUT164812,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch} and Jaroslav {Jankovský}",
  title="Current Load of Thick-film Pastes for Power Applications",
  annote="This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al 2 O 3 ). The electrical current load concerning the width of the conductive path was determined from the performed measurements. During the measuring process, the electrical current was rising by 0.1A per 10s increasing voltage and temperature. Conductive path widths from 0.20 - 0.65 in 0.05 mm steps were tested. The terminals on the samples were connected by two methods, mechanical and solder joints. Results showed that the thick-film path was working up to 550 °C, with the current load up to approximately 8.6A for mechanically connected terminals. Soldered terminals were loaded by up to 7.1A and its temperature increased to 350 °C. Both results were measured for 0.65 mm path width.",
  address="IEEE",
  booktitle="2020 43rd International Spring Seminar on Electronics Technology (ISSE)",
  chapter="164812",
  doi="10.1109/ISSE49702.2020.9121000",
  howpublished="online",
  institution="IEEE",
  year="2020",
  month="june",
  pages="1--6",
  publisher="IEEE",
  type="conference paper"
}