Publication detail

CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT BREAKER

Zelenka, M.

Original Title

CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT BREAKER

Type

conference paper

Language

English

Original Abstract

This paper deals with a thermal overload trip unit in automatically operated electrical switching devices. The first part describes an application of thermostatic bimetal in thermal overload trip unit. The main part is devoted to analytical calculation and measurement of specific thermostatic bimetal type contained in thermal trip unit of molded case circuit breaker. It is measurement of deflection depending on temperature change using photoelectric laser sensor. The analytical results are compared with the measured results at the end of the paper.

Keywords

thermostatic bimetal, molded case circuit breaker, measurement

Authors

Zelenka, M.

Released

29. 4. 2016

Publisher

VUT v Brně

Location

Brno

ISBN

9788021453500

Book

Proceedings of the 22nd Conference STUDENT EEICT 2016

Edition number

1

Pages from

467

Pages to

471

Pages count

5

URL

http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf

BibTex

@inproceedings{BUT127471,
  author="Michal {Zelenka}",
  title="CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT  BREAKER",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  number="1",
  pages="467--471",
  publisher="VUT v Brně",
  address="Brno",
  isbn="9788021453500",
  url="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf"
}