Publication detail

Influence of Flux throughout Reflow Process on FBGA Solder Balls

VALA, R. ŘIHÁK, P. SZENDIUCH, I.

Original Title

Influence of Flux throughout Reflow Process on FBGA Solder Balls

Type

conference paper

Language

English

Original Abstract

The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.

Keywords

FBGA, solder alloy, flux, X-Ray.

Authors

VALA, R.; ŘIHÁK, P.; SZENDIUCH, I.

RIV year

2015

Released

6. 5. 2015

Publisher

Budapest University of Technology and Economics

Location

Hungary

ISBN

978-963-313-177-0

Book

Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology

Pages from

250

Pages to

254

Pages count

5

URL

https://ieeexplore.ieee.org/document/7248000

BibTex

@inproceedings{BUT117451,
  author="Radek {Vala} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="Influence of Flux throughout Reflow Process on FBGA Solder Balls",
  booktitle="Novel Trends in Electronic Manufacturing  - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  year="2015",
  pages="250--254",
  publisher="Budapest University of Technology and Economics",
  address="Hungary",
  doi="10.1109/ISSE.2015.7248000",
  isbn="978-963-313-177-0",
  url="https://ieeexplore.ieee.org/document/7248000"
}