Publication detail

The Vibration Testing as Tool for Optimizing of Two PCB Connection

OTÁHAL, A. PSOTA, B. SZENDIUCH, I.

Original Title

The Vibration Testing as Tool for Optimizing of Two PCB Connection

English Title

The Vibration Testing as Tool for Optimizing of Two PCB Connection

Type

conference paper

Language

en

Original Abstract

This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

English abstract

This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

Keywords

PCB testing, vibration, simulation

RIV year

2015

Released

06.05.2015

ISBN

978-963-313-177-0

Book

Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology

Pages from

339

Pages to

342

Pages count

4

URL

BibTex


@inproceedings{BUT116876,
  author="Alexandr {Otáhal} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Vibration Testing as Tool for Optimizing of Two PCB Connection",
  annote="This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.",
  booktitle="Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology",
  chapter="116876",
  doi="10.1109/ISSE.2015.7248018",
  howpublished="online",
  year="2015",
  month="may",
  pages="339--342",
  type="conference paper"
}