Publication detail

Combined bone lesion analysis in 3D CT data of vertebrae

JAN, J. NOVOSADOVÁ, M. DEMEL, J. OUŘEDNÍČEK, P. CHMELÍK, J. JAKUBÍČEK, R.

Original Title

Combined bone lesion analysis in 3D CT data of vertebrae

English Title

Combined bone lesion analysis in 3D CT data of vertebrae

Type

conference paper

Language

en

Original Abstract

Two novel statistically based methods for bone lesion detection and classification are presented. Together with the previously published MRF method [15], they form a triad of mutually complementary methods that promise, when fused, to enable higher reliability of bone lesion assessment.

English abstract

Two novel statistically based methods for bone lesion detection and classification are presented. Together with the previously published MRF method [15], they form a triad of mutually complementary methods that promise, when fused, to enable higher reliability of bone lesion assessment.

Keywords

3D CT data, image analysis, image segmentation

RIV year

2015

Released

24.08.2015

Publisher

IEEE

Location

NEW YORK

ISBN

978-1-4244-9270-1

Book

IEEE EMBC 2015 Proceedings Milano (It)

Edition

IEEE

Edition number

1

Pages from

6374

Pages to

6377

Pages count

4

URL

Documents

BibTex


@inproceedings{BUT115898,
  author="Jiří {Jan} and Michaela {Novosadová} and Jan {Demel} and Petr {Ouředníček} and Jiří {Chmelík} and Roman {Jakubíček}",
  title="Combined bone lesion analysis in 3D CT data of vertebrae",
  annote="Two novel statistically based methods for bone lesion detection and classification are presented. Together with the previously published MRF method [15], they form a triad of mutually complementary methods that promise, when fused, to enable higher reliability of bone lesion assessment.",
  address="IEEE",
  booktitle="IEEE EMBC 2015 Proceedings Milano (It)",
  chapter="115898",
  doi="10.1109/EMBC.2015.7319851",
  edition="IEEE",
  howpublished="online",
  institution="IEEE",
  number="1",
  year="2015",
  month="august",
  pages="6374--6377",
  publisher="IEEE",
  type="conference paper"
}