Publication detail

Impact of solder paste drying on the solderability

Original Title

Impact of solder paste drying on the solderability

Czech Title

Impact of solder paste drying on the solderability

Language

cs

Original Abstract

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

Czech abstract

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

BibTex


@inproceedings{BUT109636,
  author="Alexandr {Otáhal} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Impact of solder paste drying on the solderability",
  annote="This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.",
  address="IEEE",
  booktitle="37th Int. Spring Seminar on Electronics Technology",
  chapter="109636",
  doi="10.1109/ISSE.2014.6887592",
  howpublished="online",
  institution="IEEE",
  number="37",
  year="2014",
  month="august",
  pages="198--201",
  publisher="IEEE",
  type="conference paper"
}