Project detail

IDEAS - Interactive Power Devices for Efficienty in Automotive with Increased Reliability and Safety

Duration: 01.06.2012 — 31.05.2015

On the project

The overall objective of IDEAS “Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety”, - is to develop advanced packaging for power supply components and new generation memory systems having application on Electric and ICE propelled vehicles and aiming at covering aspects not yet addressed in running ENIAC and ARTEMIS Automotive projects. A major challenge related to electronic devices in the automotive is the reliability of the power supply systems which must be capable to assure the functionality of the subsystems (See Figure 1) in all operating conditions and while ageing. Whether for conventional vehicles or electrified ones, electronic packaging impacts on the overall complexity, efficiency, safety against crash and safety against fire. The latter being a topic of increasing concern in that high currents-voltages can ignite sparks and fire which can quickly propagate to the vehicle body causing deaths and always more frequent traffic closures on Highways. Specific working groups and initiatives are now addressing these aspects with a focus on electrical vehicles. The IDEAS project addresses the minimization of the risk of fire by a design of the overall electricalelectronic packaging that will allow an adaptive partition-electrical isolation per compartments. Relevant efforts are dedicated to improve the thermal performances of the packaging of the power supply systems. On the other side the control systems, which relies on multi-core microcontroller and complex software architectures, are requiring increasingly stringent constraints from the memory devices which needs to be designed for very high bandwidth, speed and reliability. A first key objective of the project is therefore the enhancement of the power train platform to ensure the thermal performance and the reliability requirements in particular vs. thermal & power cycles and life time. This will be done by investigating novel power die attach processes and advanced interconnections technologies which are fundamental to improve the electrical performances by mean of minimising the resistance, optimizing the current distribution and increasing life time and performances vs. power cycling. An advanced technique for the front metallization of wafer will be adapted and improved at F/E level to allow innovative interconnections and cooling solution. An innovative dedicated F/E process will be defined, evaluated and validated vs. interconnections solution with regard to reliability which is the key requirement to fulfil.

Description in Czech
The overall objective of IDEAS “Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety”, - is to develop advanced packaging for power supply components and new generation memory systems having application on Electric and ICE propelled vehicles and aiming at covering aspects not yet addressed in running ENIAC and ARTEMIS Automotive projects. A major challenge related to electronic devices in the automotive is the reliability of the power supply systems which must be capable to assure the functionality of the subsystems (See Figure 1) in all operating conditions and while ageing. Whether for conventional vehicles or electrified ones, electronic packaging impacts on the overall complexity, efficiency, safety against crash and safety against fire. The latter being a topic of increasing concern in that high currents-voltages can ignite sparks and fire which can quickly propagate to the vehicle body causing deaths and always more frequent traffic closures on Highways. Specific working groups and initiatives are now addressing these aspects with a focus on electrical vehicles.

Keywords
Power Devices; Efficienty; Automotive; Reliability; Safety

Key words in Czech
Power Devices; Efficienty; Automotive; Reliability; Safety

Mark

ENIAC – 304603

Default language

English

People responsible

Kadlec Jaroslav, doc. Ing., Ph.D.
- hlavní řešitel (2012-06-01 - 2015-05-31)
Kuchtová Zdeňka, Mgr.
- spoluřešitel uvedený v projektu (2012-06-01 - 2015-05-31)
Šimková Nikola, Mgr.
- spoluřešitel uvedený v projektu (2012-10-01 - 2013-01-30)
Vrba Radimír, prof. Ing., CSc.
- spoluřešitel uvedený v projektu (2012-06-01 - 2015-05-31)

Units

Cybernetics in Material Science
- (2012-06-01 - 2015-05-31)

Funding resources

Ministerstvo školství, mládeže a tělovýchovy ČR - Společné technologické iniciativy
- part funder (2012-10-22 - 2015-05-31)

Results

NOVOTNÝ, R.; KUCHTOVÁ, Z.; KADLEC, J.; KUCHTA, R.; VRBA, R. Smart City Aspects, Services and Application A communication platform for smart cities. In The Tenth International Conference on Systems ICONS 2015. 2015. p. 1-6. ISBN: 978-1-61208-399-5.
Detail

KADLEC, J.; KUCHTA, R.; NOVOTNÝ, R. Polovodičové paměti NAND Flash. Slaboproudý obzor, 2014, roč. 70, č. 3, s. 15-21. ISSN: 0037-668X.
Detail

Arkadiusz Hajduga, Jaroslav Kadlec, Jarosław Dybowski, Joanna Kalbarczyk, Michał Sekrecki, Paweł Bańbura, Paweł Roszczyk, Radek Kuchta, Radovan Novotny, Robert Burliński, Wiesław Zieliński. Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety” – the European Project Concerning the Main Automotive and Transport Application Domains. Archiwum Motoryzacji, 2015, vol. 69, no. 3, p. 31-64. ISSN: 1234-754X.
Detail

NOVOTNÝ, R.; KADLEC, J.; KUCHTA, R. NAND Flash Memory Organization and Operations. Journal of Information Technology & Software Engineering, 2015, vol. 5, no. 1, p. 1-8. ISSN: 2165-7866.
Detail

KADLEC, J.; KUCHTA, R.; NOVOTNÝ, R.; KUCHTOVÁ, Z. A Contribution to the Evaluation of NAND Flash Memory. In ICONS2015 The First International Conference on Advances and Trends in Software Engineering - proceedings. Barcelona, Spain: IARIA, 2015. p. 74-78. ISBN: 978-1-61208-399-5.
Detail

VALACH, S.; KVÁŠ, M.: GB010; Konvertor HD SDI - 10G bit Ethernet. UAMT FEKT VUT v Brně. (prototyp)
Detail