Detail publikace

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Originální název

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Anglický název

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Jazyk

en

Originální abstrakt

This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).

Anglický abstrakt

This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).

BibTex


@article{BUT96473,
  author="Michal {Nicák} and Josef {Šandera} and Jiří {Starý} and Petr {Kosina} and Boleslav {Psota}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  annote="This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).",
  address="Fakulta Elektrotechnická ZČU v Plzni",
  chapter="96473",
  institution="Fakulta Elektrotechnická ZČU v Plzni",
  number="VI.",
  volume="2012",
  year="2012",
  month="december",
  pages="1--5",
  publisher="Fakulta Elektrotechnická ZČU v Plzni",
  type="journal article - other"
}