Detail publikace

Solder Joint Quality

SZENDIUCH, I., BULVA, J.

Originální název

Solder Joint Quality

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.

Klíčová slova v angličtině

Quality

Autoři

SZENDIUCH, I., BULVA, J.

Rok RIV

2003

Vydáno

1. 1. 2003

Nakladatel

Ing. Zdeněk Novotný, CSc., Brno

Místo

Brno

ISBN

80-214-2452-4

Kniha

Proceedings of 10-th Electronic Devices and Systems Conference 2003

Edice

Neuveden

Číslo edice

Neuveden

Strany od

388

Strany do

393

Strany počet

6

BibTex

@inproceedings{BUT8129,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Solder Joint Quality",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="6",
  publisher="Ing. Zdeněk Novotný, CSc., Brno",
  address="Brno",
  isbn="80-214-2452-4"
}