Detail publikace

Solder Joint Quality

Originální název

Solder Joint Quality

Anglický název

Solder Joint Quality

Jazyk

en

Originální abstrakt

A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.

Anglický abstrakt

A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.

BibTex


@inproceedings{BUT8129,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Solder Joint Quality",
  annote="A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.",
  address="Ing. Zdeněk Novotný, CSc., Brno",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  chapter="8129",
  edition="Neuveden",
  institution="Ing. Zdeněk Novotný, CSc., Brno",
  year="2003",
  month="january",
  pages="388",
  publisher="Ing. Zdeněk Novotný, CSc., Brno",
  type="conference paper"
}