Detail publikace

Modeling of Microelectronic Structures and Packages using ANSYS Software

Originální název

Modeling of Microelectronic Structures and Packages using ANSYS Software

Anglický název

Modeling of Microelectronic Structures and Packages using ANSYS Software

Jazyk

en

Originální abstrakt

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Anglický abstrakt

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

BibTex


@proceedings{BUT73010,
  author="Boleslav {Psota} and Ivan {Szendiuch}",
  title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
  annote="This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is
shown the comparison of three different solders and described their usage for electronic components.",
  chapter="73010",
  year="2011",
  month="may",
  type="conference proceedings"
}