Detail publikace

Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

STARÝ, J.

Originální název

Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Český název

Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Typ

norma

Jazyk

cs

Vydáno

05.03.2006

Strany od

1

Strany do

3

Strany počet

3

Dokumenty

BibTex 


@misc{BUT68190,
  author="Jiří {Starý}",
  title="Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications",
  chapter="68190",
  year="2006",
  month="march",
  pages="1",
  type="standard"
}