Detail publikace

Chybí název

Originální název

Chybí název

Anglický název

Chybí název

Jazyk

en

Originální abstrakt

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).

Anglický abstrakt

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).

BibTex


@misc{BUT60034,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Chybí název",
  annote="This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices  FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu).",
  address="Universitat Rovira i Virgili",
  booktitle="5a Conferencia de Dispositivos Electrónicos",
  chapter="60034",
  institution="Universitat Rovira i Virgili",
  journal="Nezařazené články",
  year="2005",
  month="february",
  pages="141",
  publisher="Universitat Rovira i Virgili",
  type="abstract"
}