Detail publikace

Multi Substrate Modules – Cheap Solution for 3D Packaging

Originální název

Multi Substrate Modules – Cheap Solution for 3D Packaging

Anglický název

Multi Substrate Modules – Cheap Solution for 3D Packaging

Jazyk

en

Originální abstrakt

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”.

Anglický abstrakt

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”.

BibTex


@inproceedings{BUT5147,
  author="Ivan {Szendiuch} and Josef {Šandera} and Jaromír {Bílek}",
  title="Multi Substrate Modules – Cheap Solution for 3D Packaging",
  annote="The stacked packages are one of the most significant advances for building modern electronic
systems. They give a good opportunity to built high volume three-dimensional devices with requested
quality. 3D packages deliver volumetric density through vertical stacking. This method integrates
multiple substrates and chips in a package to provide higher levels of functionality that can be
achieved through multiple package solutions technologies. The aim of this paper is to describe and
discuss some of the possible solutions, which are currently followed by research project of the Czech
Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic
Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation
of Education of Microelectronics Assembly Technologies”.",
  address="Pelkosen Painotuote",
  booktitle="Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002",
  chapter="5147",
  institution="Pelkosen Painotuote",
  year="2002",
  month="september",
  pages="114",
  publisher="Pelkosen Painotuote",
  type="conference paper"
}