Detail publikace

Development in Electronic Packaging - Moving to 3D System Configuration

Originální název

Development in Electronic Packaging - Moving to 3D System Configuration

Anglický název

Development in Electronic Packaging - Moving to 3D System Configuration

Jazyk

en

Originální abstrakt

There is described development in the electronics packaging, which moving towards 3D configurations.

Anglický abstrakt

There is described development in the electronics packaging, which moving towards 3D configurations.

BibTex


@article{BUT50420,
  author="Ivan {Szendiuch}",
  title="Development in Electronic Packaging - Moving to 3D System Configuration",
  annote="There is described development in the electronics packaging, which moving towards 3D configurations.",
  address="Czech and Slovak Universities",
  chapter="50420",
  institution="Czech and Slovak Universities",
  number="1",
  volume="April 2011",
  year="2011",
  month="april",
  pages="214--220",
  publisher="Czech and Slovak Universities",
  type="journal article"
}